Abbreviations in IC Design

IC        Integrated Circuit
3D-IC Three Dimensional Integrated Circuit
SSI      Small-Scale Integration

MSI     Medium-Scale Integration
LSI      Large Scale Integration

VLSI   Very Large Scale Integration

ULSI   Ultra Large Scale Integration
WSI    Wafer Scale Integration
SoC     System on Chip
ASIC   Application Specific Integrated Chip
ASSP   Application Specific Standard Parts
PAL     Programmable Array Logic
PLD    Programmable Logic Device
CPLD Complex Programmable Logic Device
FPGA  Field Programmable Gate Array
NOC    Network on Chip

PD       Physical Design

LD       Logic Design

DFT     Design For Test
JTAG   Joint Test Action Group
TAP      Test Access Port
BSDL   Boundary Scan Description Language
AOI      Automated Optical Inspection
AXI      Automated X-Ray Inspection
ICT       In-Circuit Test
LSSD    Level-Sensitive Scan Design
SVF       Serial Vector Format

PNR     Place and Route

APR     Advanced Place and Route

ECO    Engineering Change Order

PI         Physical Integration
FCI      Full Chip Integration
FCFP   Full Chip Floorplan
FCT     Full Chip Timing

STA     Static Timing Analysis
SI         Signal Integrity

LEC    Logical Equivalence Check

VCD    Value Change Dump

IR        Current Resistance

EM      Electro Migration

PV       Physical Verification

DRC    Design Rule Check

LVS     Layout Versus Schematic

DFM    Design For Manufacturability

PM       Pattern Matching

MAS    Manufacturability Analysis Score

OPC     Optical Proximity Correction

OATS   OPC Automation Testing

LFD     Litho Friendly Design

CPP      Contacted Poly Pitch
MMP    Minimum Metal Pitch
FIB       Focused Ion Beam

DPPM     Defective Parts Per Million

CDRS   Customer Device Requirement Spec

MEBES   Manufacturing Electron Beam Exposure System
eJDV       Electronic Job Deck View

EUV      Extreme Ultraviolet Lithography

PCB       Printed Circuit Board